发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
摘要 <p>Disclosed is a printed wiring board (1) comprising: a substrate (10) which is composed of a sheet-like reinforcing material (14) and a resin (15); a first conductor circuit (11) and a second conductor circuit (12), which are respectively formed on the major surfaces of the substrate (10); a through hole which is configured of a first opening that is tapered from a first surface toward a second surface of the substrate (10) and a second opening that is tapered from the second surface toward the first surface; and a through hole conductor (13) which is obtained by filling the through hole with a metal. The first conductor circuit (11) and the second conductor circuit (12) are electrically connected with each other by the through hole conductor (13). A part of the reinforcing material (14) protrudes into the through hole at the area where the first opening and the second opening intersect, so that the part of the reinforcing material (14) encroaches into the through hole conductor (13). Consequently, occurrence of voids within the through hole conductor (13) is suppressed as much as possible, and the mechanical bonding strength of the through hole conductor (13) is increased.</p>
申请公布号 KR20130102655(A) 申请公布日期 2013.09.17
申请号 KR20137022389 申请日期 2009.12.24
申请人 IBIDEN CO., LTD. 发明人 KAJIHARA KAZUKI
分类号 H05K3/40 主分类号 H05K3/40
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