PURPOSE: A method for manufacturing a semiconductor package is provided to improve structural stability by performing a molding progress after a conductive layer is formed on the lower surface of a lead frame. CONSTITUTION: A conductive layer is formed on the lower surface of the material of a lead frame. The material of the lead frame is divided into a die pad part (114b) and a lead part (114a). A semiconductor chip (132) is mounted on the die pad part. The semiconductor chip is electrically connected to the lead part. An etching process is performed on the conductive layer to form a first conductive pattern (116a).
