SEMICONDUCTOR MATERIAL SAWING DEVICE

摘要

PURPOSE: A semiconductor material sawing device is provided to easily perform a cutting process by adding a simple conversion unit even if a semiconductor material supply device is changed. CONSTITUTION: A pickup part (200) includes at least one pickup part. A transfer part (300) transfers the pickup part in a predetermined direction. A material supply part includes at least one material accommodating groove. The material supply part includes at least one feeder. A sawing part (500) includes at least one chuck table and at least one sawing unit.