发明名称 Expandable fluid cooling structure
摘要 A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.
申请公布号 US8534347(B2) 申请公布日期 2013.09.17
申请号 US20100926085 申请日期 2010.10.25
申请人 DENNY RONALD R.;KOWALSKI BOBBY JIM;SEWARD JAMES T.;EBSEN MICHAEL P.;ROSENTHAL THOMAS;LEINBERGER WILLIAM J.;YOUNG JEFFERY STAGG;JOSEPHSON ANDREW D.;GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS, INC. 发明人 DENNY RONALD R.;KOWALSKI BOBBY JIM;SEWARD JAMES T.;EBSEN MICHAEL P.;ROSENTHAL THOMAS;LEINBERGER WILLIAM J.;YOUNG JEFFERY STAGG;JOSEPHSON ANDREW D.
分类号 F28F7/00;H05K7/20 主分类号 F28F7/00
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