| 发明名称 |
Wiring board and power conversion device |
| 摘要 |
A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
|
| 申请公布号 |
US8537550(B2) |
申请公布日期 |
2013.09.17 |
| 申请号 |
US201113329423 |
申请日期 |
2011.12.19 |
| 申请人 |
HIGUCHI MASATO;KAWANAMI YASUHIKO;TERAZONO KATSUSHI;HIGASHIKAWA KOJI;SASAKI AKIRA;MORIHARA TAKAYUKI;AOKI TAKASHI;ITO TETSUYA;NAKABAYASHI YUKIHISA;ISOBE TASUKU;KOGUMA KIYONORI;KABUSHIKI KAISHA YASKAWA DENKI |
发明人 |
HIGUCHI MASATO;KAWANAMI YASUHIKO;TERAZONO KATSUSHI;HIGASHIKAWA KOJI;SASAKI AKIRA;MORIHARA TAKAYUKI;AOKI TAKASHI;ITO TETSUYA;NAKABAYASHI YUKIHISA;ISOBE TASUKU;KOGUMA KIYONORI |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
