发明名称 Substrate carrier and applications thereof
摘要 A substrate carrier for performing a deposition process comprises a supporting element and a cover element. The supporting element having a through hole is used to carry a substrate. The cover element is removably engaged with the supporting element, so as to secure the substrate therebetween and expose a deposition surface of the substrate from the through hole.
申请公布号 US8534659(B2) 申请公布日期 2013.09.17
申请号 US201113323941 申请日期 2011.12.13
申请人 TUNG CHUN-HSING;LIN FEI-TZU;UNITED MICROELECTRONICS CORP. 发明人 TUNG CHUN-HSING;LIN FEI-TZU
分类号 B25B1/00 主分类号 B25B1/00
代理机构 代理人
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