发明名称 |
Substrate carrier and applications thereof |
摘要 |
A substrate carrier for performing a deposition process comprises a supporting element and a cover element. The supporting element having a through hole is used to carry a substrate. The cover element is removably engaged with the supporting element, so as to secure the substrate therebetween and expose a deposition surface of the substrate from the through hole.
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申请公布号 |
US8534659(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US201113323941 |
申请日期 |
2011.12.13 |
申请人 |
TUNG CHUN-HSING;LIN FEI-TZU;UNITED MICROELECTRONICS CORP. |
发明人 |
TUNG CHUN-HSING;LIN FEI-TZU |
分类号 |
B25B1/00 |
主分类号 |
B25B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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