发明名称 |
Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus |
摘要 |
Provided are a processing method for forming division originating points in a workpiece and a laser processing apparatus performing the method, which are capable of reducing light absorption in a processing trail, increasing light extraction efficiency from sapphire, and performing high speed processing. A pulsed laser beam is irradiated to a workpiece so that irradiation regions for each of unit pulsed beams of the pulsed laser beam of ultra-short pulse are formed discretely in the workpiece, and cleavage or parting of the workpiece is sequentially generated between the irradiation regions by a shock or a stress when each of unit pulsed beam is irradiated at an irradiation point, to thereby form originating points for division in the workpiece.
|
申请公布号 |
US8536024(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US20100970144 |
申请日期 |
2010.12.16 |
申请人 |
NAGATOMO SHOHEI;SUGATA MITSURU;NAKATANI IKUYOSHI;MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
NAGATOMO SHOHEI;SUGATA MITSURU;NAKATANI IKUYOSHI |
分类号 |
H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|