发明名称 |
Solder paste transfer process |
摘要 |
A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.
|
申请公布号 |
US8534533(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US201213354080 |
申请日期 |
2012.01.19 |
申请人 |
BEAIR WILLIAM D.;WILLIAMS MICHAEL R.;GILLEY ERIC;RAYTHEON COMPANY |
发明人 |
BEAIR WILLIAM D.;WILLIAMS MICHAEL R.;GILLEY ERIC |
分类号 |
B23K31/00;B23K31/02 |
主分类号 |
B23K31/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|