| 摘要 |
An object of the present invention is to provide at a relatively cheap price a wire saw device capable of effectively preventing slurry from splashing onto the top surface of a work and effectively suppressing increase in nanotopography and Warp. The wire saw device 1 of the present invention has: a group of multiple wires 4 formed by suspending a wire 3 over a set of rollers 2, 2, 2 separate from each other so as to be aligned in a cutting side thereof in parallel to one another in the roller shaft direction X and capable of running in a direction orthogonal to the roller shaft direction; a work holding portion 5 for holding a work W and moving the work W in a direction of pushing the work W with respect to the group of multiple wires 4; and a nozzle 6 for supplying slurry to the group of multiple wires 4 from at least a position on the upperstream side in the running direction of the multiple wires 4, with respect to a path along which the work W is pushed into the wire 3. Further, the wire saw device 1 is provided with a slurry blocking plate 7, extending in the direction along which the multiple wires 4 are aligned in parallel to one another, and pivotably fixed at a base point located at least on the side at which the nozzle 6 is provided and above the multiple wires 4, such that the slurry blocking plate 7 falls, around the base point, on the work W in the direction of pushing the work W with respect to the multiple wires 4.
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