发明名称 |
High thermal conductivity hardfacing |
摘要 |
A hardmetal composition comprises tungsten carbide in an amount greater than 50 weight percent of the hardmetal composition. In addition, the hardmetal composition comprises a binder material consisting of at least 90 weight percent nickel, a binder flux between 3.5 to 10.0 weight percent chosen from the group consisting of boron and silicon, and less than 1.0 weight percent other components.
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申请公布号 |
US8535408(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US201213357244 |
申请日期 |
2012.01.24 |
申请人 |
SUE JIINJEN ALBERT;SRESHTA HAROLD;PILLAI RAJAGOPALA;REEDHYCALOG, L.P. |
发明人 |
SUE JIINJEN ALBERT;SRESHTA HAROLD;PILLAI RAJAGOPALA |
分类号 |
C22C1/05;C04B35/56;C23C4/06;E21B10/36 |
主分类号 |
C22C1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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