发明名称 Resin sheet for circuit board and production process therefor
摘要 A resin sheet (100) is provided with a resin layer (120), and a passivation layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in a plan view. The periphery of the passivation layer (110) extends outward from the periphery of the resin layer (120). The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the outside from the flat section (121). A difference between the resin thickness (d) of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% or less of the average thickness (D).
申请公布号 US8535782(B2) 申请公布日期 2013.09.17
申请号 US20080664660 申请日期 2008.07.01
申请人 MURAKAMI HARUO;SUMITOMO BAKELITE CO., LTD. 发明人 MURAKAMI HARUO
分类号 B32B3/00;B32B23/02 主分类号 B32B3/00
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