| 摘要 |
A method for producing copper fine particles by heating and reducing an oxide, hydroxide, or salt of copper included in a solution of ethylene glycol, diethylene glycol, or triethylene glycol, the method comprising controlling a total halogen content of the solution to be less than 20 ppm by mass relative to copper and adding a water-soluble polymer as a dispersant such as polyethyleneimine and a noble metal compound or noble metal colloid for nucleation to the solution. This method makes it possible to provide copper fine particles for use in a wiring material, which are very fine as small as 50 nm or less in average particle size and high dispersibility, extremely low undesirable halogen content, and can be sintered at a low temperature.
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