发明名称 |
Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
摘要 |
A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.
|
申请公布号 |
US8536494(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US20040001219 |
申请日期 |
2004.11.30 |
申请人 |
BENJAMIN NEIL;STEGER ROBERT;LAM RESEARCH CORPORATION |
发明人 |
BENJAMIN NEIL;STEGER ROBERT |
分类号 |
C23F4/00;H05B3/68;C23C16/00;H01L21/00;H01L21/02;H01L21/3065;H01L21/683 |
主分类号 |
C23F4/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|