SUBSTRATE FOR POWER MODULE

摘要

PURPOSE: A substrate for a power module is provided to improve adhesion by extending the bonding area between the molding compounds. CONSTITUTION: An insulating layer (120) is formed on a metal base substrate. A circuit layer (130) is formed on the insulating layer. The metal base substrate has at least one inclined surface (111). The inclined surface is formed on a lateral surface combined with the metal base substrate and the insulating layer. The inclined surface consists of a first inclined surface and a second inclined surface.