COMPOSITE SUBSTRATE, SEMICONDUCTOR CHIP HAVING A COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING COMPOSITE SUBSTRATES AND SEMICONDUCTOR CHIPS

摘要

The invention relates to a composite substrate (1) having a carrier (2) and a useful layer (5), wherein the useful layer is fastened to the carrier (2) by means of a dielectric connecting layer (3) and the carrier (2) contains a radiation conversion material. The invention furthermore relates to a semiconductor chip (10) having such a composite substrate, a method for producing a composite substrate and also a method for producing a semiconductor chip having a composite substrate are specified.