METHODS FOR MANUFACTURING AND SMART PACKAGING OF LIGHT EMITTING DIODE AND USING PRINTED ELECTRONICS TECHNOLOGY

摘要

PURPOSE: A method for manufacturing a light emitting diode using a printed electronics technology and a smart packaging method are provided to minimize damage to a device by using a low temperature process. CONSTITUTION: An LED chip including electrodes is prepared. A conductive strip (320) is formed on a packaging substrate (300). The conductive strip is buried in an insulating member (310). The electrodes and the conductive strip are electrically connected by a conductive material. A part of the LED chip is fixed to the packaging substrate.