PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD

摘要

The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.