LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A light emitting diode package and a method for fabricating the same are provided to prevent the penetration of moisture by encapsulating a space between a transparent member and a package body. CONSTITUTION: A package body has a cavity. A light emitting diode (33) is placed in the cavity. The light emitted from the light emitting diode passes through a transparent member (35). An adhesive bonds the transparent member and the package body together. An encapsulant (37) encapsulates a space between the package body and the transparent member.