RESIN COMPOSITION AND A MOLDED ARTICLE HAVING EXCELLENT THERMAL CONDUCTIVITY AND FORMABILITY

摘要

PURPOSE: A thermal conductive resin composition is provided to have excellent mechanical strength and high thermal conductivity, to improve the ability to process molding by improving the ability to flow, and to improve productivity. CONSTITUTION: A thermal conductivity resin composition includes 100.0 parts by weight of a matrix resin, 5-100.0 parts by weight of a fiber-reinforced material, and 50-150 parts by weight of a thermally conductive filler. The matrix resin includes 5-95 wt% of a copolymer of meta-xylenediamine and adipamide and 5-95 wt% of a polyamide 66. The fiber-reinforced material includes at least one selected from glass fiber, carbon fiber, polyacrylonitrile, and aramid fiber.