| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor substrate having a desired orientation precisely.SOLUTION: The method of manufacturing a semiconductor substrate includes following steps. An ingot 1 having a main surface 11, and a side face 12 spreading in the normal direction (a) of the main surface 11 is prepared. The ingot 1 is held by a stage 4. Orientation of the side face 12 of the main surface 11 is measured. Inclination of the side face 12 of the ingot 1 and the direction of movement c of the stage 4 is detected. Position of the ingot 1 is adjusted based on the orientation and inclination of the side face 12. The ingot 1 is cut on a face inclining for the main surface 11 thereof. |
