| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of forming a metallic compound layer in which dispersion of the in-surface thickness is reduced.SOLUTION: In the manufacturing method of a metallic compound layer, first, second and third pre-sputtering are executed before the permanent sputtering for forming a metallic compound layer 44 on a substrate 24. In the first pre-sputtering step, the first metal layer 22 of a target is exposed by executing sputtering of the target including the first metal layer 22 and a first metallic compound layer under the Ar atmosphere. In the second pre-sputtering process, a second metal layer 51a consisting of the same material as that of the first metal layer 22 is formed at least a part of an area in a chamber by executing sputtering of the target under the Ar atmosphere. In the third pre-sputtering step, a part of the first metal layer 22 is transformed into a second metallic compound layer 42b by executing reactive sputtering of the target under the Ar and Oatmosphere. |
