发明名称 PROCESS AND APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES
摘要 An apparatus and method for processing wafer-shaped articles comprises an array of nozzles that are stationary in use, and are individually controlled to simulate the action of a moving boom arm without the actual need for such an arm. Preferably three such arrays are provided, for dispensing three different types of liquid at various process stages. The computer control of the nozzle valves may cause only one nozzle of each array to be open at any given time, or may cause a pair of adjacent nozzles to be open simultaneously.
申请公布号 US2013233356(A1) 申请公布日期 2013.09.12
申请号 US201213418034 申请日期 2012.03.12
申请人 OBWEGER RAINER;BRUGGER MICHAEL;KUMNIG FRANZ;LAM RESEARCH AG 发明人 OBWEGER RAINER;BRUGGER MICHAEL;KUMNIG FRANZ
分类号 B08B3/02;B08B3/04 主分类号 B08B3/02
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