发明名称 HIGH-FREQUENCY PACKAGE
摘要 The present invention is provided with: an MMIC (3) having a signal source (4) and a conductor pattern (33) connected to the signal source (4); a substrate on which a signal line and a GND are formed and onto which the MMIC (3) is mounted; signaling-use metal bumps (21) that are formed between the MMIC (3) and the substrate and connect the conductor pattern (33) of the MMIC (3) and the signal line of the substrate; and a plurality of shielding-use metal bumps (22), which are formed between the MMIC (3) and the substrate so as to surround the signal source (4) and the conductor pattern (33) together with the signaling-sue metal bumps (21), and between which the interval, inclusive of the interval with the signaling-use metal bumps (21), is a half wavelength or less of the electromagnetic waves emitted by the signal source (4).
申请公布号 WO2013133122(A1) 申请公布日期 2013.09.12
申请号 WO2013JP55410 申请日期 2013.02.28
申请人 MITSUBISHI ELECTRIC CORPORATION;YASOOKA, KOSUKE 发明人 YASOOKA, KOSUKE
分类号 H05K9/00;H01L23/02;H01P3/16 主分类号 H05K9/00
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