发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 <p>The present invention suppresses copper corrosion due to oxygen in the air, even if treatment is performed using a liquid, such as pure water, not containing an anticorrosive, and furthermore, suppresses reattachment of particles to a substrate surface. While supplying a liquid (D) to the surface of a substrate (W), a gas (G) is supplied toward the surface of the substrate (W), such that a curtain (gas curtain) of the gas (G) is formed on the surface of the liquid (D) supplied to the surface of the substrate (W), said curtain shielding the liquid from oxygen in the atmosphere by covering the surface of the liquid.</p>
申请公布号 WO2013133401(A1) 申请公布日期 2013.09.12
申请号 WO2013JP56413 申请日期 2013.03.08
申请人 EBARA CORPORATION 发明人 IMAI, MASAYOSHI;MIYAZAKI, MITSURU
分类号 H01L21/304 主分类号 H01L21/304
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