| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for an electronic component that has high reliability of joining while making a joining temperature low.SOLUTION: A mounting method for an electronic component includes a dispersion procedure for dispersing and arranging Bi particles on a table, a press-contacting procedure for bringing the Bi particles into press contact with a solder ball by pressing the solder ball containing much tin against the table, a pressing procedure for pressing the solder ball having the Bi particles in press contact against a terminal, and a joining procedure for performing a heat treatment for joining the terminal and solder ball together at a temperature of 160-200°C while the terminal and solder ball are pressed by the pressing procedure. |
