DEVICE AND METHOD FOR PRODUCING SUBSTRATE SHEET WITH CONDUCTIVE BUMP, METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD, AND METAL MASK PLATE

摘要

PROBLEM TO BE SOLVED: To provide a device for producing a substrate sheet with a conductive bump on which a conductive bump having a desired height and an aspect ratio can be formed.SOLUTION: A device for producing a substrate sheet with a conductive bump comprises: a metal mask plate 50 on which a plurality of through holes 55 are provided; a squeegee unit for moving a squeegee 35 while pressing a metal mask plate 50, with the squeegee 35, toward a substrate sheet 10 on a printing surface plate 21 to transfer a conductive paste 40 on the metal mask plate 50 onto the substrate sheet 10 via the through holes 55. Each of the through holes 55 is constituted of an upper hole 53 having an opening nearer to a squeegee 35 and a lower hole 54 larger than the upper hole 53 and having an opening nearer to the substrate sheet 10. An annular groove 57 is provided so as to surrounding each upper hole 53, on a surface 56 defining an upper surface of each of the lower holes 54 of the metal mask place 50.