SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To suppress a connection failure between a substrate for a semiconductor package and a semiconductor device or the like.SOLUTION: The substrate for a semiconductor package includes: an insulating substrate 20 having a plurality of through holes 20h formed therein; and a metal foil having a plurality of projections 10m formed at positions corresponding to the through holes 20h. The insulating substrate 20 and the metal foil are joined together in a state where the projections 10m are inserted into the through holes 20h respectively.