发明名称 |
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDER BALL |
摘要 |
Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.
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申请公布号 |
US2013234329(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201313873801 |
申请日期 |
2013.04.30 |
申请人 |
INTETNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEZAMA RASCHID J.;DAUBENSPECK TIMOTHY H.;LAFONTANT GARY;MELVILLE IAN D.;MISRA EKTA;SCOTT GEORGE J.;SEMKOW KRYSTYNA W.;SULLIVAN TIMOTHY D.;SUSKO ROBIN A.;WASSICK THOMAS A.;WEI XIAOJIN;WRIGHT STEVEN L. |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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