发明名称 ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etching method that allows safe and simple etching and improves etching rate.SOLUTION: A method of etching a solid material includes: (1-1) bringing a material containing an organic compound having at least one kind of N-F coupling and a solid material into contact with each other; and (1-2a) applying a voltage between the material containing the organic compound having the one kind of N-F coupling and the solid material; or (1-2b) connecting one of the material containing the organic compound having the one kind of N-F coupling and the solid material to ground.
申请公布号 JP2013182963(A) 申请公布日期 2013.09.12
申请号 JP20120044865 申请日期 2012.02.29
申请人 OSAKA UNIV;DAIKIN IND LTD 发明人
分类号 H01L21/306;H01L31/04 主分类号 H01L21/306
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