发明名称 DEVICE FOR APPLYING SPUTTER ADHESION PREVENTING FLUID
摘要 PROBLEM TO BE SOLVED: To provide an applying device of a simple structure by which a sputter adhesion preventing fluid can be easily applied on a welding nozzle only by pressing the welding nozzle.SOLUTION: A device 10 for applying a sputter adhesion preventing fluid applies a preventing fluid L for preventing adhesion of sputter on a welding nozzle 2. An applying device includes: an ejector 34 which has a tray part 37 for receiving a tip end of the welding nozzle and opens a spray port 35a of the preventing fluid; a fluid side mechanical valve 45 to which a fluid side supply tube 48 is connected; an air side mechanical valve 55 to which an air side supply tube 58 is connected; a movable side member 20 which holds the ejector and the liquid side and air side mechanical valves; a fixing side member 11 which biases the movable side member upward and restricts an upper position and holds the movable side member so as to be moved vertically. The fixing side member includes a pressing part 16 which opens the fluid side and air side mechanical valves so as to supply the preventing fluid or the like to an ejector side when the tray part is pressed down by the tip end of the welding nozzle.
申请公布号 JP2013180337(A) 申请公布日期 2013.09.12
申请号 JP20120047180 申请日期 2012.03.02
申请人 TIPMAN CO LTD 发明人
分类号 B23K9/32;B05B7/06;B05B7/30 主分类号 B23K9/32
代理机构 代理人
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