发明名称 |
WAFER INSPECTION WITH MULTI-SPOT ILLUMINATION AND MULTIPLE CHANNELS |
摘要 |
Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate a set of spots on a wafer and a collection subsystem configured to collect light from the set of spots. The collection subsystem separately images the light collected from each of the individual spots onto only a corresponding first detector of a first detection subsystem. The collection subsystem also images the light collected from at least some of the individual spots onto a number of second detectors of a second detection subsystem that is less than a number of spots in the set. Output produced by the first and second detectors can be used to detect defects on the wafer. |
申请公布号 |
WO2013134631(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
WO2013US29850 |
申请日期 |
2013.03.08 |
申请人 |
KLA-TENCOR CORPORATION |
发明人 |
BIELLAK, STEPHEN;VAEZ-IRAVANI, MEHDI |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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