SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can perform a process on a main surface of the substrate using the chemical solution favourably by maintaining the chemical solution on the main surface of the substrate at a high temperature.SOLUTION: A substrate processing apparatus 1 includes: a wafer rotation mechanism 3 holding a wafer W; a peeling liquid nozzle 4 supplying an SPM liquid onto a surface of the wafer W held by the wafer rotation mechanism 3; and a heater head 35 which has an infrared lamp 38, is disposed facing the surface of the wafer W held by the wafer rotation mechanism 3, and heats the SPM liquid supplied onto the surface of the wafer W with infrared ray radiation from the infrared lamp 38. The heater head 35 is moved along the surface of the wafer W held by the wafer rotation mechanism 3.