发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT SEPARATING/RECOVERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component separating/recovering method, capable of accurately and efficiently separating/recovering an electronic component of a specific component type highly required for recycling from other component types.SOLUTION: A component recovering part 17 separates/houses and recovers an electronic component which is transferred by a mounting head 13 and determined to be a non-mounting component for which mounting operation on a substrate is not performed after recognition during a component mounting work. The component recovering part includes a first recovery chamber 18* set in one for one manner for a part of component types of electronic components specified in advance among electronic components, and a second recovery chamber 18 set to correspond to a plurality of component types other than said component type. During a component recovery operation, a non-mounting component is housed in the first recovery chamber 18* and a the second recovery chamber 18, corresponding to component type. Thus, an electronic component of a specific component type which is highly required for recycling is accurately and efficiently separated and recovered from other component types.
申请公布号 JP2013182970(A) 申请公布日期 2013.09.12
申请号 JP20120044971 申请日期 2012.03.01
申请人 PANASONIC CORP 发明人 SUMI HIDEKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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