| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding pad electrode which prevents a leak current between bonding pads while preventing peeling of the pad electrode, and to provide a formation method of the bonding pad electrode.SOLUTION: A bonding pad electrode 301 includes: a semi-insulating substrate 12 having an irregular form surface; an insulation film 21 formed on the surface of the semi-insulating substrate 12; and a pad electrode 3 formed in a predetermined position at the opposite side of the semi-insulating substrate 12 side in the insulation film 21. It is preferable to form the insulation film 21 so as to have a two layer structure. |
