| 摘要 |
When a material of an organic substrate is glass epoxy and a material of a semiconductor chip is silicon or gallium arsenide, a substrate warp sometimes occurs because of a difference between thermal expansion coefficients of the materials. The shape of the antenna formed on the organic substrate due to such a substrate warp, so that the characteristics of the antenna are sometimes shifted from desired values. An antenna is provided on the substrate on which a semiconductor chip is mounted, and is covered with a resin. The resin has enough hardness to suppress the warp caused by joining the semiconductor chip and the substrate and a transformation of the antenna. By changing a connection relation of adjustment vias after the manufacture of the semiconductor device, the characteristic of the antenna can be changed.
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