发明名称 SPLIT PUMPING METHOD, APPARATUS, AND SYSTEM
摘要 A split-pumping system and method for semiconductor fabrication process chambers is provided. The split pumping method may provide two separate exhaust paths, each configured to evacuate a different process gas. The exhaust paths may be configured to not evacuate process gases other than the process gas that the exhaust path is configured to evacuate.
申请公布号 US2013237063(A1) 申请公布日期 2013.09.12
申请号 US201313783059 申请日期 2013.03.01
申请人 VARADARAJAN SESHASAYEE;XAVIER ANTONIO;CHANDRASEKHARAN RAMESH;RUDOLPH DIRK 发明人 VARADARAJAN SESHASAYEE;XAVIER ANTONIO;CHANDRASEKHARAN RAMESH;RUDOLPH DIRK
分类号 H01L21/67;H01L21/02 主分类号 H01L21/67
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