| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip mounting substrate, capable of obtaining excellent wire bonding properties, reducing the occurrence of bridges in forming fine wiring, and having excellent solder connection reliability.SOLUTION: A method for manufacturing a semiconductor chip mounting substrate includes: a resist formation step of forming a resist 4 on a first copper layer 32 in a laminate including an inner layer plate 1 and the first copper layer provided on the inner layer plate with an insulating layer 21 interposed therebetween; a conductor circuit formation step of forming a second copper layer 5 on the first copper layer by means of electrolytic copper plating to obtain a conductor circuit 50; a nickel layer formation step of forming a nickel layer 6 on the conductor circuit by means of electrolytic nickel plating, the nickel layer having an average value of crystal grain sizes on the surface thereof of 0.15 μm or less; a first palladium layer 13 formation step of forming a first palladium layer on the nickel layer by means of electroless palladium plating; a resist removal step of removing a resist; an etching step of removing the first copper layer by etching; and a metal formation step of forming metal on the conductor circuit by means of electroless gold plating. |
