PACKAGE SHEET FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD OF THE SAME, PACKAGE FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD OF PACKAGE FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, AND SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a package sheet for a semiconductor light emitting device which enables a suspending part to be easily cut, and to provide a manufacturing method of the package sheet for the semiconductor light emitting device, a package obtained from the package sheet for the semiconductor light emitting device, a manufacturing method of the package, and a semiconductor light emitting device using the package.SOLUTION: A package sheet 1 for a semiconductor light emitting device includes: a lead frame 10 having multiple openings; and multiple light emitting element housing parts 21 formed by a resin molding 20 integrally molded with the lead frame 10. The light emitting element housing parts 21 are supported by the lead frame 10 through suspending parts 22 forming parts of the resin molding 20. A precut line 23 is provided in each suspending part 22.