发明名称 SEALING MATERIAL PASTE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a sealing material paste which enables to improve the surface smoothness of a coating layer when a sealing layer is formed using a sealing glass comprising a lead-free glass frit.SOLUTION: A sealing material paste 8 is a mixture containing: a sealing material containing a glass frit which has a softening point of ≤415°C and a difference between a crystallization peak temperature and the softening point of ≥80°C and does not substantially contain lead and 0-40 vol.% of an inorganic filler; and a vehicle prepared by dissolving an organic resin in an organic solvent. A thixotropy index TI calculated by [expression (1): TI=&eegr;/&eegr;] from a viscosity &eegr;[Pa s] of the sealing material paste 8 at a shear rate of 0.0001 [s] and a viscosity &eegr;[Pa s] of the sealing material paste 8 at a shear rate of 10 [s] is within a range of 10-1,500.
申请公布号 JP2013180902(A) 申请公布日期 2013.09.12
申请号 JP20120043658 申请日期 2012.02.29
申请人 ASAHI GLASS CO LTD 发明人 NAGAO YOHEI
分类号 C03C8/24;C03C3/064;C03C3/066;C03C8/16 主分类号 C03C8/24
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