| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing member side in the substrate 11; and a protection film 17 that is selectively provided on the surface 11a at the fixing member side in the substrate 11 so as to cover at least a part of the circuit component 12. A thermal decomposition temperature of the protection film 17 is equal to or higher than 100°C and the protection film 17 is formed by a resin that cures when energy is applied thereto. |
