| 摘要 |
PROBLEM TO BE SOLVED: To obtain a light/moisture dual curing-type curable composition improved in both of white turbidity under high-temperature high-humidity conditions after curing and deterioration of the curability of a moisture curing component therein, and to provide an electrical and electronic equipment loaded with an FPD obtained by applying and curing the composition.SOLUTION: A light/moisture dual curing-type curable composition contains: an oligomer and/or a monomer (A) having a (meth)acryloyl group, a hydroxyl group and a number average molecular weight of ≤3,000; a compound (B) having at least one hydrolyzable silyl group in one molecule on average; a compound (C), having at least one polymerizable carbon-carbon double bond in one molecule on average, other than (A); a photopolymerization initiator (D); and a curing catalyst (E); wherein the curing catalyst (E) includes phosphoric acid. |
