发明名称 ELECTRONIC DEVICE ASSEMBLY SYSTEM AND METHOD
摘要 Provided is an assembly system for assembling a double-side adhesive onto an electronic device. The assembly system includes a supporting portion and a pushing portion. The supporting portion includes a supporting surface. The supporting surface defines a cavity for receiving the electronic device. The pushing portion is supported on the supporting surface, and includes a pushing surface opposite to the supporting surface. A projection perpendicularly extends downward from the pushing surface. An elastic member is positioned on the projection. The distance between the supporting surface and the pushing surface equals to an elastic deformation value of the elastic member in a direction substantially perpendicular to the supporting surface.
申请公布号 US2013233462(A1) 申请公布日期 2013.09.12
申请号 US201213653622 申请日期 2012.10.17
申请人 CHEN PO-CHOU 发明人 CHEN PO-CHOU
分类号 B29C65/50;B32B37/12 主分类号 B29C65/50
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