| 摘要 |
This substrate processing apparatus is provided with: a cassette placing unit, which has placed thereon a cassette for substrates to be processed, said cassette housing a plurality of substrates to be processed, and a cassette for dummy substrates, said cassette housing a plurality of dummy substrates; a processing chamber for processing the substrates to be processed or the dummy substrates, or both the substrates to be processed and the dummy substrates; a substrate supporting unit, which is provided in the processing chamber, and which has a plurality of substrate placing sections disposed on the circumference thereof, said substrate placing sections respectively having substrate placing surfaces for placing the substrates; a gas supply unit, which supplies a processing gas to the inside of the processing chamber; an air-releasing unit, which releases air from the inside of the processing chamber; a transfer unit, which transfers the substrates between the cassette placing unit and the processing chamber; and a control unit, which controls at least the substrate processing performed in the processing chamber, and the substrate transfer performed by means of the transfer unit. |
