| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which an upper electrode is stably bonded on a top face of a circuit pattern, and provide a manufacturing method of the circuit board.SOLUTION: A circuit board comprises: a circuit pattern 22; and an upper electrode 30 bonded on a top face of the circuit pattern 22 by a bonding material 40. The upper electrode 30 includes: a horizontal part 36 which extends along the top face of the circuit pattern 22 and serves as a part bonded with the top face of the circuit pattern 22 by the bonding material; a standing part 34 for external connection; and horizontal parts 31, 33 and vertical parts 32, 35 which serve as a jig receiving for receiving a jig. |
