MANUFACTURING METHOD OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of electrically connecting a substrate mounted with a semiconductor element and a wiring board without using FPC when the electronic component in which the substrate mounted with the semiconductor element is vertically provided to an installation surface of the wiring board is manufactured.SOLUTION: A manufacturing method of an electronic component includes the steps of: mounting an IC 11 on a second surface of a wiring board 13 in a state that a first angle which is an intersection angle between a surface parallel to a first surface of the IC 11 and the second surface of the wiring board 13 is larger than 0 degrees and is smaller than 180 degrees; mounting the wiring board 13 on a third surface 15d of a stage 15 in a state that a surface facing opposite to the second surface of the wiring board 13 faces the third surface 15d of the stage 15 having the third surface 15d inclined against a horizontal surface 15f by a second angle α2 larger than 0 degrees; and connecting a first electrode positioned on the first surface and a second electrode positioned on the second surface by a bonding wire A in a state that a surface facing opposite to the first surface of the IC 11 faces a stage 15 side.