| 摘要 |
PROBLEM TO BE SOLVED: To immediately learn abnormalities such as peeling and breakage of a junction of a sensor chip.SOLUTION: In a differential pressure sensor 200 including a sensor chip 3 joined to a wall surface 1-1a of a partition wall 1-1 located on the side of a first space 1-2 by making one surface 3-1a of a sensor diaphragm 3-1 face a first pressure receiving diaphragm 2-1, and making a communication passage 3-3 leading to the other surface 3-1b of the sensor diaphragm 3-1 communicate with a through passage 1-4 of the partition wall 1-1, sealing pressure of a first medium 5-1 for transmitting pressure to be sealed in a first encapsulation chamber 6-1 is differentiated from sealing pressure of a second medium 6-2 for transmitting pressure to be sealed in a second encapsulation chamber 6-2, and abnormalities of junctions 4-1, 4-2 of the sensor chip 3 are determined from fluctuation of pieces of their sealing pressure. |
