SEMICONDUCTOR DEVICE, COOLING SYSTEM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress a warp of a semiconductor integrated circuit.SOLUTION: A semiconductor device 10 includes a plurality of semiconductor integrated circuit elements 12, solder bumps 26 and spacer substrates 14. The plurality of semiconductor integrated circuit elements 12 respectively include through vias 22 and are laminated. Each solder bump 26 connects a through via on one semiconductor integrated circuit element 12 to a through via on another semiconductor integrated circuit element 12. The spacer substrates 14 are placed among the plurality of semiconductor integrated circuit element 12 and bonded to each of the plurality of semiconductor integrated circuit element 12. Each spacer substrate 14 includes through holes 40 for accommodating the solder bumps 26 at positions corresponding to the solder bumps 26. The spacer substrate 14 also includes a resin layer 30, and among the plurality of through holes 40 on the resin layer 30, a groove 42 is formed to pass coolant.