发明名称 BONDING METHOD, BOND STRUCTURE, AND MANUFACTURING METHOD FOR SAME
摘要 Provided are a bonding method which can obtain a bond section which has no air gaps, is precise, has high heat-resistance and excellent reliability, and a bond structure having a highly reliable bond section. When bonding a first object to be bonded (3) and a second object to be bonded (13) using an insert material (C), the first object to be bonded (3) and/or the second object to be bonded (13) include a first metal formed from Sn or an alloy containing Sn, an insert material (D) is disposed between the first object to be bonded and the second object to be bonded and heat treatment is carried out, the insert material (D) having, as the main component thereof, a second metal which is an alloy containing Cu and at least one metal selected from Ni, Mn, Al and Cr, and the first object to be bonded and the second object to be bonded are bonded by generating intermetallic compounds between the alloy contained in the insert material and a low melting point metal included in the first object to be bonded and/or the second object to be bonded.
申请公布号 WO2013132954(A1) 申请公布日期 2013.09.12
申请号 WO2013JP53028 申请日期 2013.02.08
申请人 MURATA MANUFACTURING CO.,LTD. 发明人 NAKANO, KOSUKE;TAKAOKA, HIDEKIYO
分类号 B23K35/22;B23K1/00;B23K35/26;B23K35/30;B23K101/42;C22C9/00;C22C9/01;C22C9/05;C22C9/06;C22C13/00;C22C13/02;H05K3/34 主分类号 B23K35/22
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