Method for polishing surface of edge of disk of semiconductor material e.g. silicon wafer, involves conveying polishing agent to surface of edge of semiconductor wafer disk through auxiliary borehole over suction opening at front side

摘要

The method involves polishing a surface of an edge of a semiconductor wafer disk (1) in presence of a polishing agent by polishing tools (4) with a front side. The polishing tools are provided with a main borehole (6a) and an auxiliary borehole (6b) led from the main borehole. The polishing agent is conveyed to the surface of the edge of the semiconductor wafer disk through the auxiliary borehole over a suction opening at the front side. The polishing tools are engaged with a polishing cloth on the front side. Different amounts of the polishing agent are conveyed through the suction opening.