| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which improves the reliability of an element joint part by a resin mold and achieves high cooling performance and the downsizing, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device includes: a cooler 20 where a coolant passage is formed inside; insulation substrates 31 to 34 fixed to an outer surface of the cooler 20; transistors Q1 to Q6 and diodes D1 to D6 which are mounted on the insulation substrates 31 to 34; and conductive plates 70, 72, 74, 76, 78 and a connection pin 86 which are electrically connected with the transistors Q1 to Q6 at the one end sides. The insulation substrates 31 to 34 are brazed to the outer surface of the cooler 20. The one end sides of the insulation substrates 31 to 34, the transistors Q1 to Q6, the diodes D1 to D6, and the conductive plates 70, 72, 74, 76, 78 and the one end side of the connection pin 86 are molded to the cooler 20 by a resin 40 with the other end sides of the conductive plates 70, 72, 74, 76, 78 and the other end side of the connection pin 86 exposed. |
